What is Electroforming?
Electroforming is a specialized electrochemical manufacturing process used to create precise, high-fidelity metal parts by depositing metal onto a mold or patterned substrate. Unlike conventional electroplating, which mainly serves to coat a surface, electroforming allows the metal layer to build up with such precision that, once separated from the mold, it forms a self-supporting, free-standing metal structure. The basic principle of electroforming involves submerging both a conductive mold (cathode) and a metal source (anode) into a specially formulated electrolyte bath containing metal ions. A direct current is passed through the system, causing metal ions from the anode to dissolve into the electrolyte and migrate toward the cathode. There, they gain electrons and are reduced to form a solid metal layer that mirrors the mold’s intricate surface details. This technique allows for the production of components with extremely fine geometries, high dimensional accuracy, and excellent surface finishes. Electroforming is widely used in industries such as microelectronics, precision engineering, medical devices, jewelry manufacturing, and advanced filtration.
The accompanying diagram illustrates the basic electroforming setup: the anode releases metal ions into the solution, while the cathode—the mold—attracts and deposits these ions, gradually building up the desired metal layer. Once the process is complete, the metal layer can be carefully separated from the mold, resulting in a finished part that exactly replicates the mold’s shape and texture. Electroforming stands at the intersection of art and science, delivering a combination of engineering precision and creative freedom unmatched by other metal-forming processes.
Electroforming Process Flow
Electroforming is a precision metal forming process that uses electrodeposition to create intricate metal components with high accuracy and complex geometries. The process allows for the production of seamless, high-fidelity metal structures that replicate the shape of a mold or substrate. Below is a typical electroforming process flow:
1. Master Pattern Preparation
A highly precise master pattern (mandrel) is created using materials like wax, plastic, or metal. The surface is carefully finished to ensure high replication accuracy.
2. Conductive Layer Application
If the master is non-conductive, a thin conductive layer (such as silver, copper, or graphite coating) is applied to enable the electroforming process.
3. Electroforming (Metal Deposition)
The prepared master is submerged into an electrolyte solution containing metal ions. By applying a controlled electric current, metal ions deposit onto the master’s surface, gradually forming a solid metal layer.
4. Thickness Control
The electroforming time and current density are precisely controlled to achieve the desired metal thickness and mechanical properties.
5. Master Removal
After reaching the target thickness,
the electroformed part is separated from the master. Depending on the mandrel material, this step may involve chemical dissolution, melting, or mechanical separation.
6. Post-Treatment and Finishing.
The electroformed component may undergo surface finishing, polishing, heat treatment, or other processes to meet specific application requirements.
Through this controlled electroforming process, we achieve highly precise metal parts with fine details, excellent surface finish, and superior dimensional accuracy — making electroforming the ideal solution for high-precision applications across industries.
Electroforming products application industry introduction
Electroformed Mesh
High Precision and Consistency
Line width (bar width): 20 µm
Thickness range: 20–200 µm
Sharp edges with near-vertical sidewalls — No corner radius (R angle)
Precision Electroformed Sieve
Manufactured through advanced electroforming technology, Precision Electroformed Sieves deliver exceptional dimensional accuracy, ultra-fine aperture control, and superior consistency across every piece. With sharp edges, smooth surface finish, and the ability to achieve micron-level openings, they are ideal for high-precision filtration, particle analysis, and specialized industrial applications.
*Engineered for Accuracy and Performance*
Precision encoder disk
Precision encoder disks are widely used in motion control systems, robotics, industrial automation, precision measurement equipment, medical devices, and optical instruments. With their micron-level resolution and stable signal output, they ensure accurate position detection, speed control, and feedback in high-precision applications where reliability and consistency are critical.
Precision Electroformed Stencil
Crafted through advanced electroforming technology, our Precision Electroformed Stencil offers micron-level aperture accuracy, smooth sidewalls, and superior surface finish. With excellent tension stability, sharp definition, and the ability to produce ultra-fine and complex patterns, it ensures consistent paste release and reliable performance in high-end semiconductor packaging, fine-pitch SMT, and microelectronics applications.
Wafer Ball Placement Stencil
Due to the extremely high number of apertures — often in the hundreds of thousands or even millions — laser cutting is not feasible for wafer ball placement stencils. Meanwhile, chemical etching cannot achieve the required precision for such fine apertures. Therefore, electroforming is typically the preferred manufacturing method. These stencils are widely used in 4-inch to 12-inch wafer-level packaging (WLP) processes for high-precision solder ball placement.
Electroformed Wafer Mask
An electroformed wafer mask is a precision mold used in micro- and nano-fabrication. It is created by forming fine metal structures (such as nickel) on the wafer surface through electroforming technology. The typical manufacturing process involves coating a photoresist layer on a silicon substrate, patterning it via exposure and development, depositing metal by electroforming, and finally stripping off the resist to obtain the metal mask. This technique offers high resolution and excellent aspect ratio, making it ideal for mass production of MEMS, optical components, and semiconductor devices. The key challenges lie in controlling electroforming uniformity and internal stress to ensure dimensional accuracy and structural integrity of the mask.
Inspection & Testing Equipment
Our facility is equipped with a full range of precision inspection and testing instruments to ensure product quality, dimensional accuracy, and material consistency. The lineup includes fully automatic stencil inspection machines, high-resolution video measuring systems, flash measurement instruments for instant dimensional checks, and advanced AOL optical inspection devices for defect detection. We also operate a dedicated chemical analysis laboratory for material verification and hardness testers for mechanical property assessment. These comprehensive tools allow us to maintain strict quality control throughout the production process, meeting the demanding standards of precision manufacturing.:
Committed to Precision. Focused on Quality. Ready for Your Challenges.
We strive to deliver high-quality products and reliable solutions through advanced technology, precision craftsmanship, and a dedication to customer success. Contact us today to explore how we can support your business。